제조사 / 판매자 | (주)에스에프에이반도체[바로가기] |
---|---|
연락처 | 041-520-6400 |
브랜드 | - |
제품코드 | 35734 (제품 정보 수정 및 삭제 요청시 필요) |
제품명 | Plastic Ball Grid Array |
모델명 | - |
사이즈 | - |
중량 | - |
주의사항 | 아래는 참고용 정보이므로 세부 조건은 반드시 제조사/판매자에게 문의 바랍니다. |
Description
PBGA is a die-up design, plastic overmolded BGA using 2, 4 or 6 layer BT substrate and 1.0 or 1.27mm ball pitch and above. It offers high a I/O replacement for the QFP package when the I/O exceeds QFP-256 limitations. SFA SEMICON's PBGA offers improved electrical and thermal operation through multiple routing layers such as ground and power planes. Additionally, industry proven processes and materials provide assurance for reliable and long-term operation.
Application
ㆍMicroprocessors / controllers, ASICs, Gate Arrays, memory, DSPs, PLDs, graphics and PC chip sets
ㆍwireless telecommunications, GPS, laptop PC’s, video cameras, disc drives, PLDs, graphics
Feature
ㆍJEDEC Standard compliance
ㆍMCP / SiP / Flip chip
ㆍGreen materials (Pb-free / RoHS compliance)