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Overview
PLD (Pulsed Laser Deposition) is a physical deposition method that utilizes a high energy
focused laser. Conceptually and experimentally. PLD is extremely simple. It consists of a
target holder and a substrate holder housed in a vacuum chamber. A set of optical
components focus and raster a high-power laser (the external source) into a
concentrated beam over the target surface which vaporizes target materials to
ultimately deposite thin film.
Advantages
≻ Allows for the use of various targets and for the in-situ deposition of multi-layers
≻ Consists of simple hardware
≻ Simple system maintenance
≻ Various aspect of beam-target-substrate positioning
≻ Temperature uniformity of substrate
≻ Pyrometer Port
≻ Laser strength measurement port
≻ Ellipsometry port
UHV chamber Ultimate Pressure | up to 5.0E-9Torr |
Two Chamber System | Process chamber & Loadlock chamber |
Uniformity Zone of Substrate Heating | Ø15 mm |
Substrate Temperature | 850°C ± 5°C in oxygen |
Operating Pressure | 0.01mTor ~ 10 Torr |
Target Carousel | one inch (25.4mm) diameter for four targets |
Normal Angle of Incidence | Laser beam on target : 45° with respect to target normal |
Loading type | Easy to load or unload sample and target by magnetic transfer |
RHEED (Reflection High-Energy Electron Diffraction) | |
CCD Camera for Oscillation of RHEED | |
Pyrometer for measuring substrate temperature |
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Overview
PLD (Pulsed Laser Deposition) is a physical deposition method that utilizes a high energy
focused laser. Conceptually and experimentally. PLD is extremely simple. It consists of a
target holder and a substrate holder housed in a vacuum chamber. A set of optical
components focus and raster a high-power laser (the external source) into a
concentrated beam over the target surface which vaporizes target materials to
ultimately deposite thin film.
Advantages
≻ Allows for the use of various targets and for the in-situ deposition of multi-layers
≻ Consists of simple hardware
≻ Simple system maintenance
≻ Various aspect of beam-target-substrate positioning
≻ Temperature uniformity of substrate
≻ Pyrometer Port
≻ Laser strength measurement port
≻ Ellipsometry port
Uniformity Zone of Substrate Heating | Ø15 mm |
Substrate Temperature | 850°C ± 5°C in oxygen |
Operating Pressure | 0.01 mTorr ~ 10 Torr |
Target Carousel | one inch (25.4mm) diameter for four targets |
Normal Angle of Incidence | Laser beam on target : 45° with respect to target normal |
Operational Wavelength | 248 nm (KrF) |
Base Pressure | 2.0E-7 Torr using turbo molecular pump |
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