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Plasma Etching System
Model Name
MPI-6000/8000
Series
Semiconductor Equipment
Data
-
Manufacturer information
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MIS

Semi conductor manufacturing equipment manufacturer, Auto Decaper, Track System, Vacuum Valve and more

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Manufacturer
MIS
Brand
-
SKU
43681
Product Name
Plasma Etching System
Model Name
MPI-6000/8000
Size
-
Weight
-
Product Details

Function & Features 
 

- Plasma를 이용한 반도체 불량 분석 장비 
- ICP(Inductively Coupled Plasma) type, CCP(Capacitively Coupled Plasma) type으로 나눔 
- Wafer(Silicon) 에칭, 반도체 MCP(Multi chip package)의 실리콘 다이(상층)을 에칭하여 정밀분석이 가능
- 실리콘 Layer, WBL, 다프(DAF) 에칭 가능
- 분석용도에 가장 적합한 공정조건 제공 
- 다량의 시료를 동시에 작업 진행할 수 있는 챔버 시스템 
- Technology
   > Ion density uniformity is below 2% on 6 inch substrate 
   > Active substrate temperature control(He backside cooling) 
   > Very high etch rate 
   > Recipe storage and data logging 
   > Z-axis motion control 
   > Higher Uniformity by Planar ICP antenna design 
   > Exactly same gas conductance by unique gas diffusion gun design

 

Specification(ICP type)

Item Description
Chamber 1 process chamber, 1 load lock chamber with standard wafer
magazines, Compact & Automatic load/lock system
Arm transfer Robot arm transfer module
Process module Planar type high density plasma source, Electrostatic wafer clamping
with He backside cooling
RF System Source 13.56MHz / 2.0 kW
Bias 13.56MHz / 600 W, Auto matching network
Vacuum control Auto pressure control with throttle valve
Gas channel Max. 6ch Gas delivery module with mass flow controller
Operation PC base control including Windows user interface for fully automatic
process control
Dimension 1,550(W) x 1,255(D) x 2,090(H) mm
Weight Approx. 120 kg (8 inch type)
Semi conductor manufacturing equipment manufacturer, Auto Decaper, Track System, Vacuum Valve and more
MIS Auto Decaper is the world’s first automated robot system that safely and effectively removes the surface molding (EMC: Epoxy Molding Compounds) of packaged semiconductors and electronic parts. It is the only machine that can substitute the existing decapsulation work that is mostly done by hands and several machines. In addition, MIS has released the world’s first etching machine, Deprocessor (Auto Wet Station) that can decap micromini semiconductors and can do the partial etching work for silicone chips and the delaminating work (which has the precision of micro meter) that selectively and safely delaminates the layer of the chip composed of several layers.  For this, in December 2005, MIS made a contract for joint technical execution with Korea Institute of Science and Technology, and worked on the research and development. The project was selected by Samsung Electronics as a str-ategic task and in February 2007, MIS Auto-Deprocessor (Auto Wet Station) was developed and supplied.  And then, it was acknowledged by the Korea Development Bank in terms of its technology and business possibility so it successfully attracted some funds from it and since then, MIS has been doing its best.  The semiconductor etching work needed several machines and dangerous manual works, but now it can be done by 1 unit of MIS auto robot system. MIS has been putting its focus on the development of the equipment making prompt and precise work performance.  As a result of the efforts, now MIS can guarantee safety in working for those who use equipment, and further, it can bring the improvement in working efficiency and the remarkable reduction of production costs to customers.  MIS will keep working on research and development, and will exert itself to develop new and innovative products with the best performance in the fields of nano processing systems and displays. MIS will do its best for customersatisfaction. 
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