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Green Sheet Pattern Inspection System
Model Name
2D/3D USCAN 3000
Series
Ceramic Green Sheet
Data
-
Manufacturer information
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Synapse Imaging

Semi conductor inspection system manufacturer, Inspection equipment, Measuring equipment, SMT, Wafer, FPP panel

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Manufacturer
Synapse Imaging
Brand
-
SKU
34983
Product Name
Green Sheet Pattern Inspection System
Model Name
2D/3D USCAN 3000
Size
-
Weight
-
Product Details

Green Sheet Pattern Inspection System is an optical vision inspection equipment designed for inspecting all appearance defects found on the patterns printed on ceramic green sheets. One of the benefits of the 3D μSCAN is that quality defects resulting from variations in the thickness (height) of patterns, which are difficult to detect using conventional inspection equipments, can be detected by measuring the sheet surfaces and the height of the patterns. In contrast, the 2D μSCAN is an inspection method that uses image information obtained from projecting a special type of light designed in consideration of the differences in the reflections between patterns and sheets, and can perform inspection with greater throughput. The 2D μSCAN and the 3D μSCAN use the same mechanical platform, but the optical systems and software they use are different. The key benefit of the 3D μSCAN is that 2D inspection can be selectively performed, along with 3D inspection. The advantage of this product is to selectively perform 3D inspections like 3D μSCAN and 2D inspections such as 2D μSCAN. 
 
Synapse Imaging Green Sheet Pattern Inspection System 2D/3D USCAN 3000

Synapse Imaging
Semi conductor inspection system manufacturer, Inspection equipment, Measuring equipment, SMT, Wafer, FPP panel
Based on the key policy “We make only number one quality products leading market,” Synapse Imaging has been focusing on development of advanced new technologies and competitive products every year to provide more value to customers. Various automated optical inspection systems developed by our company have been received the best reputation in the semiconductor IC packaging industry for over ten years since our foundation in year 2002. Also, we have been extending application of our unrivalled inspection technologies to various other electronic industrial areas such as Display panel, PCB, SMT, Green Sheet, LED and mobile phone manufacturing processes. Our 3D solder paste inspection system features its outstanding performance compared to the existing other 3D SPI systems in terms of speed and precision in 3D measurement. We have received a “Technology Innovation Award” AT Nepcon Shanghai Exhibition, which is one of the largest global electronic assembly equipment exhibitions. Based on the diverse technologies and experiences, various market-leading 3D/2D combined inspection systems including Semiconductor substrate inspection system, Green sheet inspection system, FC bump inspection system, Wafer inspection system and 3D scanner are among our best sellers. Recently, we developed successfully a series of automated optical inspection systems for OLED/LCD display and TSP manufacturing processes for SMART phone devices and are extending the scope of the products to the new display panel markets. Synapse Imaging will continue to develop new inspection technologies to meet demand on cutting edge manufacturing technologies and keep up the leader in the global market of automated optical inspection systems.
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