Semi conductor inspection system manufacturer, Inspection equipment, Measuring equipment, SMT, Wafer, FPP panel
Green Sheet Pattern Inspection System is an optical vision inspection equipment designed for inspecting all appearance defects found on the patterns printed on ceramic green sheets. One of the benefits of the 3D μSCAN is that quality defects resulting from variations in the thickness (height) of patterns, which are difficult to detect using conventional inspection equipments, can be detected by measuring the sheet surfaces and the height of the patterns. In contrast, the 2D μSCAN is an inspection method that uses image information obtained from projecting a special type of light designed in consideration of the differences in the reflections between patterns and sheets, and can perform inspection with greater throughput. The 2D μSCAN and the 3D μSCAN use the same mechanical platform, but the optical systems and software they use are different. The key benefit of the 3D μSCAN is that 2D inspection can be selectively performed, along with 3D inspection. The advantage of this product is to selectively perform 3D inspections like 3D μSCAN and 2D inspections such as 2D μSCAN.