Based on the key policy “We make only number one quality products leading market,” Synapse Imaging has been focusing on development of advanced new technologies and competitive products every year to provide more value to customers. Various automated optical inspection systems developed by our company have been received the best reputation in the semiconductor IC packaging industry for over ten years since our foundation in year 2002. Also, we have been extending application of our unrivalled inspection technologies to various other electronic industrial areas such as Display panel, PCB, SMT, Green Sheet, LED and mobile phone manufacturing processes. Our 3D solder paste inspection system features its outstanding performance compared to the existing other 3D SPI systems in terms of speed and precision in 3D measurement. We have received a “Technology Innovation Award” AT Nepcon Shanghai Exhibition, which is one of the largest global electronic assembly equipment exhibitions. Based on the diverse technologies and experiences, various market-leading 3D/2D combined inspection systems including Semiconductor substrate inspection system, Green sheet inspection system, FC bump inspection system, Wafer inspection system and 3D scanner are among our best sellers. Recently, we developed successfully a series of automated optical inspection systems for OLED/LCD display and TSP manufacturing processes for SMART phone devices and are extending the scope of the products to the new display panel markets. Synapse Imaging will continue to develop new inspection technologies to meet demand on cutting edge manufacturing technologies and keep up the leader in the global market of automated optical inspection systems.