제조사 / 판매자 | (주)에스에프에이반도체[바로가기] |
---|---|
연락처 | 041-520-6400 |
브랜드 | - |
제품코드 | 35737 (제품 정보 수정 및 삭제 요청시 필요) |
제품명 | Small Outline Package |
모델명 | - |
사이즈 | - |
중량 | - |
주의사항 | 아래는 참고용 정보이므로 세부 조건은 반드시 제조사/판매자에게 문의 바랍니다. |
Description
SFA SEMICON’s broad portfolio of Small Outline Package (SOP) include the popular “gullwing” lead formats. Statistically controlled and refined assembly processes coupled with very high quality materials assure the best SOP packages available for your semiconductor devices. These IC packages have proven surface mount (SMT) performance characteristics and have been designed to adopt easily to all SMT processes and lines. SFA SEMICON’s wide array of SOIC packages provide component and packaging engineers the ability and freedom to optimize systems and product designs.
Application
ㆍHandheld devices, Cellular phones, PDAs, MP3s,
ㆍConsumer (audio, video, entertainment)
ㆍTelecommunications (pagers, cordless telephone)
ㆍRF / wireless (PC cards, RF/CATV, telemetry)
ㆍOffice (fax, copier, printer)
ㆍPC/peripheral
ㆍAutomotive
Feature
ㆍJEDEC Standard compliance
ㆍGreen materials (Pb-free / RoHS compliance)
ㆍLead pitch ≥ 1.27mm