(주)에스에프에이반도체
Series5
WLCSP
Flip Chip
Laminate
Lead Frame
Storage
제품
QFN : Quad Flat No Leads
-
TSOP : Thin Small Outline Package
SOP : Small Outline Package
QFP : Quad Flat Package
DIP : Dual In-line Package
TO-220
http://www.sfasemicon.com/
041-520-6400
041-520-7490
gyuho.lee@sfasemicon.com
충청남도 천안시 서북구 백석공단7로 16 (STS반도체통신(주))
