product Image
Semi COG Bonder (2Head)
Model Name
-
Series
Module Line
Data
-
Manufacturer information
provider logo
Yujin Discom

LCD, OLED, PDP, VFD, Touch Panel Semi conductor equipment

Problem with product info?
Update request
Manufacturer
Yujin Discom
Brand
-
SKU
32853
Product Name
Semi COG Bonder (2Head)
Model Name
-
Size
-
Weight
-
Product Details

This machine is to bond the IC chip on the LCD glass. IC chip supplied automatically from the tray by robot arm. LCD glass loading is manual, alignment and IC chip bonding is automatic. (ACF bonding process should be done with ACF bonding machine.)

 

SPECIFICATIONS

EQUIP. DIMENSION

1160(L)mm×840(W)mm×1690(H)mm

WEIGHT

500Kg

IC CHIP SIZE

4~23mm(L), 1.0~5mm(W)

GLASS SIZE

1.0” ~ 7.0”

PATTERN PITCH

38 ㎛ (25㎛ 2 line )

BONDING ACCURACY

±5 ~ 6 ㎛

TACKTIME(1 IC BONDING)

9~12sec

AILGNMENT

Vision System (Auto Alignment)

BONDING HEAD

2 Head

UTILITY

MAIN POWER:220V±10%, 2.0KW, 50/60Hz

AIR : 5~6 Kg/cm2, 250L/min, Ø8 Hose

Yujin Discom
LCD, OLED, PDP, VFD, Touch Panel Semi conductor equipment
Our company established at 1993.5 by the name of Yu-Jin Synthetic machinery. Since then, we have developed and invested in technology to lead Korean LCD manufacturing field. We have already sold and export our machines to SAMSUNG SDI, HYUNDAI, LG and many other company. Now, we will satisfy you with our creative technology from last 10 years know-how. For the best performance and for the highest productivity we make every effort from design to deliver. Yu-Jin DISCOM will be with you and Yu-Jin can manufacture the machine that exactly what you need. Research and development of the value for Human, Technology, Environment is the spirit of Yu-Jin DISCOM.
Inquiry