LCD, OLED, PDP, VFD, Touch Panel Semi conductor equipment
This machine is to bond the ACF attached panel with FPC film after align, with heat and pressure. (Turn type, 1 head / 2 turn stage)
SPECIFICATIONS |
|
EQUIP. DIMENSION |
920(L)mm×650(W)mm×1770(H)mm |
WEIGHT |
220Kg |
PANEL SIZE |
16~75(W), 15~61(L) <3.5”max> |
PANEL THICKNESS |
(0.3~1.1)*2mm |
1 FPC BONDING TIME (S/T) |
20sec (bonding time 15sec 시) |
FPC THICKNESS |
0.1~0.2mm |
PATTERN PITCH |
0.1mm(max) |
BONDING ACCURACY |
±12~15 ㎛ |
EMPERATURE |
Room Temperature ~ 350℃(controller 상) |
UTILITY |
MAIN POWER:220V±10%,1.2KW, 50/60Hz |
AIR : 5~6 Kg/cm2, 240L/min, Ø10 Hose |