전자현미경, 전자빔용접기, 주사전자현미경(SEM), 전자빔, FE-SEM 전문 제조사
설명 : 세계 최초로 기술 개발한 E-Beam Micro Joining System (Micro Welding)
특징
1) 고 분해능을 지닌 Sub-micron 크기의 부품 용접 및 Joining : Probe Current (~100uA for Macro Joining)
2) SEM과 Joining을 융합한 Hybrid 제품.
3) 고객 사양의 제품화 가능 — 기술 Consulting 지원
4) Chamber내에 Micro-manipulator장착 가능
5) 다양한 기능 탑재 가능 (확장성)
6) BSE detector를 통한 실시간 가공 처리의 동영상 관찰가능
제품사양
Gun Specification
Source Tungsten Hair-Pin Filament(LaB6/ Th coated Tungsten Filament 적용 Available)
Low Power & High Performance
Fast response system for preventing welding
High welding quality and welding repeatability,
Possibility of gun mounting on a robotic manipulator
Voltage power 35KeV (Max.40KeV)
Beam current max. 50uA(Guaranty사양) – (최대 Ip ≥ 100uA)
Inspection Resolution : Minimum 5nm
Seam Tracking with BSE detector – Cooling System prevent damage from thernal-electron
Application
E-beam Micro Joining with surface cleanness.
Quality welding of metal with high reflexibility Ag, Cu, etc.
Micro Metal Powder Melting ; Ti, Al, Cobalt-Chrome, Alloy powder, etc.
Fine and complicated structure SOS (System on Chip), Precision Valve.
Wetting/Joining for CPU Casing, Gas Sensor.
Precision parts welding for Aircraft, Automobile industry, Aerospace and Power Engineering.