개요
Sorting된 Chip을 고속으로 Leadframe에 접착시키는 장비입니다.
특징
Thin die handling without any die crack
- Using specialized patent air ejector
- Handling 25↑㎛ die thickness
High productivity and excellent accuracy
- 2-step bonding for thin & large size die
- Placement accuracy : ±15㎛@3σ (with under vision)
- 4M vision installation (substrate, under vision)
- High accurate dispenser unit