(주)에스에프에이반도체
제품
16FO-WLP : Fan Out Wafer Level Package
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CoC, CoW : Chip on Chip, Chip on Wafer
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FCCSP : Flip Chip Chip Scale Package
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FCBGA : Flip Chip Ball Grid Array
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FBGA : Fine-pitch Ball Grid Array
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FBGA Stack Die : Fine-pitch Ball Grid Array Stack Die
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SIP : System in Package
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PBGA : Plastic Ball Grid Array
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QFN : Quad Flat No Leads
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TSOP : Thin Small Outline Package
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SOP : Small Outline Package
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QFP : Quad Flat Package
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DIP : Dual In-line Package
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TO-220
Micro SD Card : Micro Secure Digital Card
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SD Card : Secure Digital Card
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(주)에스에프에이반도체
충청남도 천안시 서북구 백석공단7로 16 (STS반도체통신(주))