FO-WLP : Fan Out Wafer Level Package

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CoC, CoW : Chip on Chip, Chip on Wafer

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FCCSP : Flip Chip Chip Scale Package

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FCBGA : Flip Chip Ball Grid Array

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FBGA : Fine-pitch Ball Grid Array

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FBGA Stack Die : Fine-pitch Ball Grid Array Stack Die

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SIP : System in Package

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PBGA : Plastic Ball Grid Array

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QFN : Quad Flat No Leads

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TSOP : Thin Small Outline Package

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SOP : Small Outline Package

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QFP : Quad Flat Package

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DIP : Dual In-line Package

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TO-220

Micro SD Card : Micro Secure Digital Card

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SD Card : Secure Digital Card

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