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FCCSP : Flip Chip Chip Scale Package
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FCCSP : Flip Chip Chip Scale Package
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SFA Semicon

Assembly and Test, Bumping, Packaging semi conductor manufacturing, Assembly, Inspection, Toll processing, Image analysis transport manufacturing

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Manufacturer
SFA Semicon
Brand
-
SKU
35729
Product Name
FCCSP : Flip Chip Chip Scale Package
Model Name
-
Size
-
Weight
-
Product Details

Description

The fcCSP package is the main platform in flip Chip package family, which includes bare die type, Molded (CUF,MUF) types, SiP types, Hybrid (fcSCSP) types and a package sub-system meeting the standard BGA footprint that contains multiple components within the same package (MCM fcCSP). Options also include configurations with thin core, Pb-free and Cu Pillar bump and process method (Mass reflow, TCNCP). The Flip chip CSP packages are suitable for low lead count, high frequency, high performance, and portable products such as performance memory, RFICs, and DSPs.

 

Application

High End & Low End Package

ㆍAutomotive

ㆍTelecommunication

ㆍComputer

ㆍConsumer

 

Feature

ㆍBump pitch : Min.130um (Solder bump)

ㆍCu Pillar (TCNCP ≤ 50um / Mass Reflow ≤ 130um)

ㆍDie size : 0.8~12.5mm

ㆍPackage size : 3~19mm

SFA Semicon
Assembly and Test, Bumping, Packaging semi conductor manufacturing, Assembly, Inspection, Toll processing, Image analysis transport manufacturing
SFA Semicon is a leading independent assembly and test service provider offering full turnkey solutions from wafer bumping, assembly and testing through drop-shipment with wide range of package solutions and advanced technology and high quality of engineering and manufacturing services. SFA Semicon is also the world’s leading manufacturing service provider of advanced memory card (storage) products. SFA Semicon, Korea-based largest assembly and test service provider, has been expanding our ability to provide the service globally through China and Philippines plants and is enabling customers to delivery most competitive prices, high level quality management and core strengths in research and development (R&D), design and sales marketing. Based on our semcondutor manfacturing capabilities, high level of production quality control and customer support, we are expanding our business engagement to top global semicondutor companies and helping them a success. SFA Semicon is fully committed to support the best satisfaction and value creation of shareholders, customers and employees and improvement of corporate sustainability and management system. SFA Semicon will continue our efforts to provide most advanced leading technology, high quality control, customer service and growth of company, which will return of good profit to the stockholders and employees. We appreciate all your warm support and attention for the success of SFA Semicon.
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