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Assembly and Test, Bumping, Packaging semi conductor manufacturing, Assembly, Inspection, Toll processing, Image analysis transport manufacturing
Description
The fcCSP package is the main platform in flip Chip package family, which includes bare die type, Molded (CUF,MUF) types, SiP types, Hybrid (fcSCSP) types and a package sub-system meeting the standard BGA footprint that contains multiple components within the same package (MCM fcCSP). Options also include configurations with thin core, Pb-free and Cu Pillar bump and process method (Mass reflow, TCNCP). The Flip chip CSP packages are suitable for low lead count, high frequency, high performance, and portable products such as performance memory, RFICs, and DSPs.
Application
High End & Low End Package
ㆍAutomotive
ㆍTelecommunication
ㆍComputer
ㆍConsumer
Feature
ㆍBump pitch : Min.130um (Solder bump)
ㆍCu Pillar (TCNCP ≤ 50um / Mass Reflow ≤ 130um)
ㆍDie size : 0.8~12.5mm
ㆍPackage size : 3~19mm